产品介绍

LBD-GPP150 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

LBD-GPP150系列热传导界面材料是填充发热器件和散热片或金属底座之间的空气间隙，它们的柔性、弹性特征使其能够用于覆盖非常不平整的表面。热量从分离器件或整个PCB传导到金属外壳或扩散板上，从而能提高发热电子组件的效率和使用寿命。

产品特性

● Thermal conductivity 热传导率: 1.5W/m-K

● Very soft & high compressibility 超软及高压缩性

● Natural tacky 自黏性

● Good Electrically isolating 高耐电压

● Easy to assembly 易于施工

产品应用端

● Power Supplies 电源模块

● Automotive control services 汽车控制服务

● Military Electronics 军用电子

● LED Lighting, LCD-TV LED照明设备，平面显示器

● Telecom services, Wireless instruments 电信服务，无线仪器

● Computer services: CPU, Heat sink, Memory modules 计算机服务：CPU，散热器，记忆存储模块

产品配置

● Standard size 标准尺寸： 200mm×400mm 、300mm×400mm

● Custom Die-cut shapes 不同形状冲型裁切

● 0.3~10mm thickness optional 0.3~10mm厚度可选

● With or without adhesive 可依需求背胶